BACK END PROCESSOR INPUT/OUTPUT BOARD FOR LOGIQ E9 ULTRASOUND SYSTEM by GE Healthcare

Product Brief: BACK END PROCESSOR INPUT/OUTPUT BOARD FOR LOGIQ E9 ULTRASOUND SYSTEM by GE Healthcare

Key Highlights

• Robust Design: The Back End Processor (BEP) Input/Output Board is engineered for high performance in the LOGIQ E9 and VIVID E9 ultrasound systems, ensuring reliable operation in demanding clinical environments.
• Comprehensive Kit: This board includes essential components such as connectors, capacitors, inductors, and ICs, providing a complete solution for system integration and maintenance.
• Durability and Compliance: Manufactured with corrosion-resistant materials and high dielectric strength, the board is designed to withstand moisture and provide long-term reliability. It is also ROHS compliant, ensuring adherence to environmental standards.
• Precision Engineering: Crafted using high-precision techniques, this board achieves excellent surface finish and product consistency, which is critical for optimal system performance.
• Ease of Installation: The design allows for straightforward installation and removal, enhancing workflow efficiency in clinical settings.

Compatible Systems & Use Cases

• Models:
  • LOGIQ E9
  • VIVID E9

Use Cases: This I/O board is primarily utilized in ultrasound imaging systems, facilitating the connection and communication between various internal components. It is suitable for diagnostic imaging in obstetrics, cardiology, and general imaging applications.

Technical Specifications

Clinical and Service Value

The Back End Processor Input/Output Board for the LOGIQ E9 Ultrasound System significantly enhances procurement strategies by providing a reliable and comprehensive solution for system maintenance. Its robust design minimizes downtime, ensuring that imaging services remain uninterrupted. The inclusion of multiple components within a single kit simplifies inventory management, allowing healthcare facilities to streamline their procurement processes while reducing the risk of component mismatch.

From a maintenance perspective, the board's ease of installation and removal contributes to improved workflow efficiency. Biomedical engineers can quickly replace or upgrade components without extensive training, thus reducing the time spent on service calls. The high precision and durability of the board further ensure that it meets the rigorous demands of clinical environments, thereby enhancing the overall reliability of ultrasound imaging systems. This not only supports optimal patient care but also aligns with the operational goals of healthcare providers seeking to maximize equipment uptime and performance.

Additional notes

The Back End Processor (BEP) Input/Output (I/O) Board in Ultrasound is used in LOGIQ E9 and other medical equipments as applicable. It is a kit which comprises of connectors, capacitors, inductors, resistors, IC’s, diodes, memory eeprom, LED’s, protection fuse, receiver flat panel display, transmitter, ferrite bead, IO card fab, screws, bracket-bep io board, locking post kit, gaskets, foam insulator and BEPIO boot prom software. The I/O board is inserted into the BEP frame. While removing, all the I/O cables should be disconnected at the top of the BEP. The product material offers corrosion resistant, high dielectric strength, moisture resistant and strength to weight ratio. It is manufactured using high precision techniques which helps to achieve a good surface finish as well as good product consistency. Additional Features: ROHS compliant